HITEC EN 268 is a low-phosphorus bright electroless nickel plating process that exhibits excellent stability. The coating is flexible, has a high melting point (1250 ℃), high hardness (640-700 HV100), and good conductivity, making HITEC EN 268 suitable for high brazing requirements and general engineering applications. The deposition rate of HITEC EN 268 is 15-20μm/hour, and it has a wide temperature range of 60-85 ℃. It is widely used in carbon steel, stainless steel, copper alloys, titanium, aluminum alloys, and insulating materials such as plastics and ceramics. HITEC EN 268 A and B are used for cylinder lining, while A and C are used for additives.
